Fluid-Cooled Systems Reports

Monitoring the Computer Room's Physical Environment
sponsored by Sensaphone
WHITE PAPER: This paper addresses the greatest environmental threats to the functionality of small to medium computer rooms and presents the time and cost savings associated with the integration of a remote monitoring system.
Posted: 22 Apr 2008 | Published: 22 Apr 2008

Sensaphone

Humidification Stratiegies for Data Centers and Network Rooms
sponsored by Schneider Electric
WHITE PAPER: This paper explains the nature of humidity, its effects and its management in computer rooms and data centers.
Posted: 26 Mar 2014 | Published: 20 Nov 2008

Schneider Electric

Liebert: The Right Cooling for IT Environments
sponsored by Emerson Network Power
WHITE PAPER: Many IT professionals are finding that dedicated precision cooling is the right solution to provide the ideal environment for sensitive electronics. Read this paper to learn why precision cooling is the optimal choice for keeping data centers cool in the most cost-effective way.
Posted: 13 Jul 2010 | Published: 13 Jul 2010

Emerson Network Power

Cooling Cost-Saving Strategies: Comfort Cooling vs. Precision Cooling
sponsored by Emerson Network Power
WHITE PAPER: Important differences exist between precision cooling and building air conditioning (comfort cooling) in controlling these environmental conditions. In this paper, we compare both cooling systems’ ability to maintain favorable environmental conditions, and their energy efficiency and annual operating costs.
Posted: 11 Oct 2010 | Published: 11 Oct 2010

Emerson Network Power

Frequently Asked Questions about Virtualization and the Microsoft/AMD Solution
sponsored by AMD, Hewlett-Packard and Microsoft
WHITE PAPER: With virtualization, businesses can increase IT capacity at a lower cost, reduce energy costs and carbon footprint, and have a computing platform that can easily scale as their needs evolve. This white paper details the benefits businesses can achieve through virtualization.
Posted: 16 Aug 2010 | Published: 11 Aug 2010

All resources sponsored by AMD, Hewlett-Packard and Microsoft

Optimizing Capacity and Efficiency in a Diverse and Variable Load Environment
sponsored by Tate
WHITE PAPER: This whitepaper explains the need for local and dynamic airflow delivery technology and illustrates how these technologies work together with existing IT cooling systems to meet this variable load demand while maintaining high reliability and lowering energy costs.
Posted: 13 Dec 2010 | Published: 13 Dec 2010

Tate

Intel Intelligent Power Node Manager
sponsored by Intel
WHITE PAPER: With calls for efficiency and shrinking budgets, it is certain that any attempt to reduce power consumption will be welcome. Take a look at this exclusive resource to learn how implementing a power capping, monitoring and allocating application can improve overall performance and energy consumption in your data center.
Posted: 08 Aug 2011 | Published: 08 Aug 2011

Intel

Impact of High Density Hot Aisles on IT Personnel Work Conditions
sponsored by Schneider Electric
WHITE PAPER: This white paper discusses the issue of increasing discomfort for computer room workers in high power density data centers.
Posted: 10 Oct 2013 | Published: 10 Oct 2013

Schneider Electric

Liebert® CRV™ Row-Based Cooling: Intelligent Precision Cooling for Data Center Equipment
sponsored by Emerson Network Power
BROCHURE: In 2002, Emerson Network Power's Liebert XD family was the industry's first row-based cooling system. Now, we have taken more than 40 years of engineering experience and the most advanced technologies to design the Liebert CRV row-based precision cooling system. Learn the flexibility, TCO and availability benefits of their latest cooling solution.
Posted: 22 Jan 2010 | Published: 22 Jan 2010

Emerson Network Power

Intel Xeon Processor 5600 Series
sponsored by Dell, Inc. and Intel®
PRODUCT OVERVIEW: This product overview points out the key constraints on today's infrastructures. Find out how upgrading to multi-core servers can free up space, labor, and power and cooling resources.
Posted: 29 Jun 2011 | Published: 29 Jun 2011

Dell, Inc. and Intel®